Towards a reliable laser process for surface preparation before bonding
F. Crestey, S. Kirchner, J. Lecomte, L. Ferres - IRT St Exupery, France, A. Fernandez - Airbus, Spain, C. Debras - Thales Alenia Space, France, M. Peron - ArianeGroup, France, N. Cuvillier - Safran Composites, France, T. Balutch - Naval Group, France
Précédent
Assembly of power semiconductor components by thermocompression of porous electrochemical copper films
Suivant
